Electromechanic assembly

ASSEMBLY

  • AOI in 2D.
  • AOI in 3D, with capacity for PCB with measurements above the standard and components up to an encapsulation of size 01005.
  • Assembly of electronic cards in equipment.
  • Welding equipment for conventional or THT components.
  • Electromechanical equipment verification teams.
  • Card verification equipment.
  • Conventional component assembly or THT.
  • Assembly of SMD components (BGA’s, QFN’s, 01005, etc.)
  • Pick & place Samsung, with capacity for PCB with measures above the standard o Automatic screen printing, with capacity for PCB with measures above the standard.
  • Remelting welding.
  • SPI (screen printed paste inspection) 3D, with capacity for PCB with measurements above the standard.
  • Control and traceability computer system by reading bar codes of the components used for each assembly.

In Electrónica SELCO we differentiate ourselves by the exhaustive control of manufacturing and quality.

Selco-Fabricacion