ASSEMBLY
- AOI in 2D.
- AOI in 3D, with capacity for PCB with measurements above the standard and components up to an encapsulation of size 01005.
- Assembly of electronic cards in equipment.
- Welding equipment for conventional or THT components.
- Electromechanical equipment verification teams.
- Card verification equipment.
- Conventional component assembly or THT.
- Assembly of SMD components (BGA’s, QFN’s, 01005, etc.)
- Pick & place Samsung, with capacity for PCB with measures above the standard o Automatic screen printing, with capacity for PCB with measures above the standard.
- Remelting welding.
- SPI (screen printed paste inspection) 3D, with capacity for PCB with measurements above the standard.
- Control and traceability computer system by reading bar codes of the components used for each assembly.
- Automatic selective soldering line.
- Smart cabinet for MSL control and traceability.
In Electrónica SELCO we differentiate ourselves by the exhaustive control of manufacturing and quality.