ASSEMBLY

• AOI in 2D.
• AOI in 3D, with capacity for PCB with measurements above the standard and components up to an encapsulation of size 01005.
• Assembly of electronic cards in equipment.
• Welding equipment for conventional or THT components.
• Electromechanical equipment verification teams.
• Card verification equipment.
• Conventional component assembly or THT.
• Assembly of SMD components (BGA’s, QFN’s, 01005, etc.)
• Pick & place Samsung, with capacity for PCB with measures above the standard o Automatic screen printing, with capacity for PCB with measures above the standard.
• Remelting welding.
• SPI (screen printed paste inspection) 3D, with capacity for PCB with measurements above the standard.
• Control and traceability computer system by reading bar codes of the components used for each assembly.

In Electrónica SELCO we differentiate ourselves by the exhaustive control of manufacturing and quality.