Electromechanic assembly

ASSEMBLY

  • AOI in 2D.
  • AOI in 3D, with capacity for PCB with measurements above the standard and components up to an encapsulation of size 01005.
  • Assembly of electronic cards in equipment.
  • Welding equipment for conventional or THT components.
  • Electromechanical equipment verification teams.
  • Card verification equipment.
  • Conventional component assembly or THT.
  • Assembly of SMD components (BGA’s, QFN’s, 01005, etc.)
  • Pick & place Samsung, with capacity for PCB with measures above the standard o Automatic screen printing, with capacity for PCB with measures above the standard.
  • Remelting welding.
  • SPI (screen printed paste inspection) 3D, with capacity for PCB with measurements above the standard.
  • Control and traceability computer system by reading bar codes of the components used for each assembly.
  • Automatic selective soldering line.
  • Smart cabinet for MSL control and traceability.

In Electrónica SELCO we differentiate ourselves by the exhaustive control of manufacturing and quality.

Selco-Fabricacion