Electrostatic discharge (ESD) can compromise the quality and functionality of electronic products during production or installation. With SELCO’s protection system, the risk of electrostatic discharge can be avoided during the production process.
Humidity control according to IPC/JEDEC J-STD-033D-SP
This control helps to avoid damage due to moisture adsorption and exposure to reflow temperatures which can result in damaged components and deterioration of productivity and reliability.
Electrostatic discharge (ESD) can compromise the quality and functionality of electronic products during production or installation. With SELCO’s protection system, the risk of electrostatic discharge can be avoided during the production process.
Humidity control according to IPC/JEDEC J-STD-033D-SP
This control helps to avoid damage due to moisture adsorption and exposure to reflow temperatures which can result in damaged components and deterioration of productivity and reliability.
Our experienced staff, together with our equipment and specialised machinery, means that SELCO has extensive production capacity for large runs of boards and electronic equipment. This allows us to supply companies and customers of very different sizes and specific needs.
Estimates of our production capacity per year are about 1,000,095,000 components in the SMD section, which is about 127,000 components per hour. In addition, we assemble 215,000 electromechanical assemblies per year and more than 350,000 electronic boards per year.
Verification of all the PADs to control the correct deposition of paste.
We check that there are no paste residues or foreign objects on the entire surface of the PCB.
- 3D SPI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Automated Measurement of PCB Warpage
- Automated Compensation of PCB Stretch and Shrinkage
- Process Optimization with Feedback & Feedforward Linkage Support
- Inspection Items Height, Area, Volume, Offset, Bridge, Shape, PCB Warpage, PCB Shrink, etc.
We assemble all kinds of PCBs: rigid, aluminium, flexible, etc.
We assemble all kinds of components: QFN, BGA, Fine pitch, 01005…
- Placement Speed Chip 127,000CPH (Optimal)
- Applicable Component 0402(01005inch) ~ Max. □14mm (h12mm)
- Placement Accuracy ±40㎛@μ±3σ/Chip, ±50㎛@μ±3σ/QFP
- Applicable PCB L610xW460
Verification of all components to check: presence, polarity, flatness and soldering.
We check that there are no foreign objects on the entire surface of the PCB.
- 3D AOI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Inspection of up to 65mm Height
- Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
- Inspection Items Dimension, Missing, Misalignment, Wrong, Side Mount, Tombstone, Text(OCR/OCV), Solder Joint, Lead Lift, Lead Missing, Lead Offset, Bridge, Color Band, Pin, Coplanarity, etc.
The first in-line selective system with dual transport: maximum flexibility and highest throughput in the smallest footprint.
Fluxer: 130 µm stainless steel drop-jet.
Preheater: combination of IR and convection.
Welding module: with electromagnetic pumps to achieve maximum repeatability.
We verify 100% of the manufactured items.
We subject our processes and final products to the most rigorous quality tests, guaranteeing that they reach the market with the highest standards.
- ICT (In Circuit Testing)
- FCT (Functional Circuit Test)
Our X-ray equipment is perfect for ensuring high quality on the production line. Detects a wide range of manufacturing defects that are not visible with other equipment: BGA, QFN and IGBT solders, PTH filling, interfacial voiding, component cracking and counterfeit device detection.
3D reconstruction is also possible with our team’s computed tomography. In this way, errors can be recognized, volumes reconstructed, structures measured in real units of measure, but also individual layers or sectional views can be created.
State-of-the-art coating line, bringing excellence to the coating of electronic components. The advantages of UV-cured coatings over acrylic coatings are greater resistance to abrasion, chemicals and corrosion; greater flexibility, durability and sustainability; greater safety and shorter curing time.
Nordson Asymtek SL940: micrometric precision ensures consistent coating application on complex and delicate surfaces. Its advanced control system offers exhaustive control over crucial parameters, allowing fine adjustments to suit the most demanding specifications.
MSTech Lite UVLED395 Oven (Snap Cure): High power UVLED light source ensures fast and uniform curing. In addition, precise curing control ensures ideal curing conditions without compromising component integrity.
Advanced storage system integrated in our ERP to offer our customers: precise control, operational efficiency, guaranteed traceability and regulatory compliance (ESD and IPC/JEDEC J-STD-033).
Incoming Material Station (IMS): makes the reception and sorting of materials easier by incorporating barcode scanning technology, integrated with our management system.
Essegi ISM3600 cabinets: these cabinets offer safe and organised storage with large capacity and humidity control systems.
Modula Lift vertical storage: makes maximum use of vertical space and with its automated system allows quick and efficient access to stored components.
Vccount X-Ray Counter: it is a high-precision, high-performance system that allows electronic components to be counted quickly and easily. It also allows high-resolution images of electronic components to be obtained, making it easy to identify and count them. It can count up to 100,000 components per hour and is integrated with our ERP.
All electronic components are identified with a unique code that allows us to maintain the traceability of each of the components used in the assemblies.
Soldering with nitrogen supply from our own nitrogen generation station with a purity below than 5 ppm, guaranteeing maximum reliability in soldering.