Electrostatic discharge (ESD) can compromise the quality and functionality of electronic products during production or installation. With SELCO’s protection system, the risk of electrostatic discharge can be avoided during the production process.
Humidity control according to IPC/JEDEC J-STD-033D-SP
This control helps to avoid damage due to moisture adsorption and exposure to reflow temperatures which can result in damaged components and deterioration of productivity and reliability.
Electrostatic discharge (ESD) can compromise the quality and functionality of electronic products during production or installation. With SELCO’s protection system, the risk of electrostatic discharge can be avoided during the production process.
Humidity control according to IPC/JEDEC J-STD-033D-SP
This control helps to avoid damage due to moisture adsorption and exposure to reflow temperatures which can result in damaged components and deterioration of productivity and reliability.
Our experienced staff, together with our equipment and specialised machinery, means that SELCO has extensive production capacity for large runs of boards and electronic equipment. This allows us to supply companies and customers of very different sizes and specific needs.
Estimates of our production capacity per year are about 1,000,095,000 components in the SMD section, which is about 127,000 components per hour. In addition, we assemble 215,000 electromechanical assemblies per year and more than 350,000 electronic boards per year.
Verification of all the PADs to control the correct deposition of paste.
We check that there are no paste residues or foreign objects on the entire surface of the PCB.
- 3D SPI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Automated Measurement of PCB Warpage
- Automated Compensation of PCB Stretch and Shrinkage
- Process Optimization with Feedback & Feedforward Linkage Support
- Inspection Items Height, Area, Volume, Offset, Bridge, Shape, PCB Warpage, PCB Shrink, etc.
We assemble all kinds of PCBs: rigid, aluminium, flexible, etc.
We assemble all kinds of components: QFN, BGA, Fine pitch, 01005…
- Placement Speed Chip 127,000CPH (Optimal)
- Applicable Component 0402(01005inch) ~ Max. □14mm (h12mm)
- Placement Accuracy ±40㎛@μ±3σ/Chip, ±50㎛@μ±3σ/QFP
- Applicable PCB L610xW460
Verification of all components to check: presence, polarity, flatness and soldering.
We check that there are no foreign objects on the entire surface of the PCB.
- 3D AOI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Inspection of up to 65mm Height
- Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
- Inspection Items Dimension, Missing, Misalignment, Wrong, Side Mount, Tombstone, Text(OCR/OCV), Solder Joint, Lead Lift, Lead Missing, Lead Offset, Bridge, Color Band, Pin, Coplanarity, etc.
The first in-line selective system with dual transport: maximum flexibility and highest throughput in the smallest footprint.
Fluxer: 130 µm stainless steel drop-jet.
Preheater: combination of IR and convection.
Welding module: with electromagnetic pumps to achieve maximum repeatability.
We verify 100% of the manufactured items.
We subject our processes and final products to the most rigorous quality tests, guaranteeing that they reach the market with the highest standards.
- ICT (In Circuit Testing)
- FCT (Functional Circuit Test)
Our X-ray equipment is perfect for ensuring high quality on the production line. Detects a wide range of manufacturing defects that are not visible with other equipment: BGA, QFN and IGBT solders, PTH filling, interfacial voiding, component cracking and counterfeit device detection.
3D reconstruction is also possible with our team’s computed tomography. In this way, errors can be recognized, volumes reconstructed, structures measured in real units of measure, but also individual layers or sectional views can be created.
All electronic components are identified with a unique code that allows us to maintain the traceability of each of the components used in the assemblies.
Soldering with nitrogen supply from our own nitrogen generation station with a purity below than 5 ppm, guaranteeing maximum reliability in soldering.